MPi Wafer Probe Cards
Canteliver Probe Card
MPI Cantilever Probe Card is extensively used on gold bump and pad wafer testing for Screen driver, logic, and memory device. MPI’s cantilever probes are definitely the corresponding solution to your requires of fine pitch, small pad dimension, substantial pace, much less cleaning, multi-DUT, large pin rely, and ultra-lower leakage prerequisites. With outstanding craftsmanship, progressive architecture and established methodologies based upon mechanical and electrical simulation/measurement success, making MPI the top cantilever service provider globally.
FCB Probe Card
The FCB Probe Card is the most experienced technology of buckling beam probe card. It is aimed to achieve the semiconductor ship manufacture time-to-market (TTM) and price of exam (COT) desire. FCB can be a established Resolution for many different semiconductor manufacturing tests from early engineering pilot-runs to higher quantity production (HVM). FCB is ready for device demanding substantial signal integrity probing (SI) and/or power integrity probing (PI). Purposes incorporate reducing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and much more. FCB assures the globe’s very best overall Charge-of-ownership (COO) for various DUT apps.
EVS Probe Card
The EVS Probe Card is surely an improvement in excess of the conventional buckling beam probe card. Critical read more functions are higher latest carrying capacity (C.C.C.) and decreased balanced Get hold of power (BCF), and Total MEMS-like characteristics. EVS can certainly fulfill the necessity of Highly developed wafer probing. Exact alignment and fantastic planarity Handle are definitely the crucial things contributing to stable Get hold of resistance. With its capacity and effectiveness, EVS Probe Card is a perfect choice for Highly developed probe cards.
Osprey probe card
The Osprey probe card is MPI’s Remedy to demand from customers for ever finer pitch. It really is created for smaller Al pad, and it is ideal for little pitch software with peripheral and complete array pattern. With exact alignment and improved planarity control, Osprey can achieve increased efficiency by multi-DUT structure. The forming wire (FW) kind needle developed with MPI’s individual micro fabrication process not just delivers large-good quality effectiveness but will also allows simple needle substitute and shortens preserving cycle time.
Kestrel Probe Card
The Kestrel Probe Card is supplied with MEMS wire (MW) needle which can be made for the need of minimal power probing. In addition, it comes with the ability to satisfy superior C.C.C. and superior pin counts software. The MEMS approach assures very steady needle traits, and also the special composition structure allows precise alignment and planarity Command.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
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